Fluid delivery ring and methods for making and implementing the same

ABSTRACT

A fluid delivery module for use in preparing a substrate is provided. The fluid delivery module includes a process bowl designed to contain a substrate to be prepared. The process bowl has a bottom wall and a sidewall. The fluid delivery module further includes a fluid delivery ring configured to be attached to the sidewall of the process bowl. The fluid delivery ring includes a plurality of inlet and outlet pairs. Each of the plurality of inlet and outlet pairs is defined in the fluid ring and is designed to receive a respective supply tube. Each respective supply tube has an end that terminates at each of the outlets of the fluid delivery ring and is configured to direct fluid onto a surface of the substrate.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates generally to semiconductor wafer cleaningand, more particularly, a fluid delivery ring to be utilized insemiconductor wafer spin, rinse, and dry (SRD) modules.

2. Description of the Related Art

Wafer preparation and cleaning operations are performed in fabricationof semiconductor devices. In one of such wafer preparation operations, awafer is spin rinsed in a spin, rinse, and dry (SRD) module. Asimplified schematic diagram of an exemplary prior art SRD module 100 isprovided in FIG. 1. As illustrated, the SRD module 100 includes a bowl102 rigidly mounted on an SRD housing 118. The SRD housing 118 has abore to receive a shaft 117, which is coupled to a motor 116. The motor116 causes the shaft 117 and thus the spindle 106 and a wafer 102 torotate in a rotation direction 112. A chuck 110 extends through the bowl102 and is mounted on a spindle 106. A seal 126 is defined between thespindle 106 and the shaft 117 in order to prevent chemicals from exitingthe SRD module. Four spindle fingers 108 coupled to the chuck 110,support the wafer 104 along its edges. In the SRD module 100, the chuck110 moves vertically in the movement direction 114. As such, the chuck110 moves upwardly in the bowl 102 such that it extends outside the bowl102 and above bowl lips 102 a. Once the wafer 104 is delivered to thespindle fingers 108 at a level above the bowl lips 102 a, the chuck 110moves downward and back into the bowl 102 such that the wafer 104 isdisposed below the bowl lips 102 a.

A backside rinse nuzzle 124 mounted on the inner surface of bottom wallof the bowl 102 sprays liquid (e.g., DI water) onto the bottom side ofthe wafer 104. A spigot 120 is disposed above the bowl 102 and above thewafer 104. A fluid (e.g., DI water) supplied to the spigot 120 through atube 122 is sprayed onto the surface of the wafer 104 as the wafer isspun at high revolutions per minute (RPMs). The spigot is designed tomove horizontally, in the spigot movement direction 121. At theconclusion of the rinsing operation, the accumulated fluid is drainedthrough the drain port 128 defined in the bottom wall of the bowl 102 aswell as the bottom wall of the SRD housing 118. Once the surface of thewafer 104 and the bottom of the wafer 104 are sprayed with fluid, thesupplying of fluid is stopped by turning off the spigot 120. Thereafter,the wafer 104 is dried by being spun at high RPMs. As soon as the waferis dried, the chuck 110 is once again moved upward from within the bowl102 and is extended to the outside of the bowl 102 and the bowl lips 102a so as to unload the processed wafer 104.

Several problems can be associated with the conventional SRD module 100.One primary concern associated with the conventional SRD module is theuse of a single spigot for fluid delivery onto the surface of the wafer.One problem with the use of the single point fluid delivery spigot isthat such system fails to yield an optimum rinsing operation as someportions of the wafer may not be exposed to sufficient amount of rinsingfluid. A second major problem is that the use of spigots may result inthe recontamination of a processed wafer. This occurs because even afterthe fluid delivery has seized, excess liquid still remains in the spigot120. As such, frequently, the excess fluid (e.g., DI water) remained inthe spigot 120 flows out of the spigot 120 and drips on an otherwiseclean surface of the wafer 104 recontaminating the surface of theprocessed wafer (e.g., causing stains or particulate spots). When suchdripping occurs, the SRD operation must be repeated again (if detected),thereby reducing throughput as a result of increasing the overall timeexpended in the SRD module. If the problem is undetected, the quality ofthe cleaning goes down.

Another problem associated with the typical SRD module is havingchemically incompatible components. In a typical SRD module, the chuck110 is usually made out of Aluminum, the bowl 102 is made out ofpolyurethane, and the spigot is made out of stainless steal. Thesecomponents may enter into chemical reactions with the fluids introducedinto the SRD module. As a consequence, further contaminants may beintroduced into the SRD module. For instance, as the chuck 110 moves upand down within the bowl 102, some of its coating flakes off of thechuck thus generating particulates and contaminants inside the bowl 102and the SRD module 100. These contaminants may react with the residualchemicals (e.g., HF, NH₃OH, etc.) present in the SRD module from theprevious operation of brush scrubbing of the wafer surfaces. As a resultof such chemical reactions between the generated particulates andcontaminants of the chuck 110 with the residual chemicals, the wafer 104as well as the SRD module is recontaminated.

In addition to introducing contaminants, the typical SRD module utilizesa chuck having an extremely complex design. In the conventional SRDmodule, the chuck 110 moves up and down through the bowl 102 to receiveand deliver the wafer 104. As such, it is imperative that the chuckremain properly calibrated so that it comes to rest at the exactorientation. In situations where the chuck is not properly aligned, thefailure to properly receive and deliver the wafer, mandates therealignment of the chuck. The process of realigning the chuck is verytime consuming and labor intensive. Consequently, in order to realignthe chuck, the SRD module must be taken off-line for an extended periodof time thus reducing the throughput.

In view of the foregoing, a need therefore exists in the art for achemically compatible SRD module that enables efficient rinsing of asurface of a substrate without recontaminating the substrate surface.

SUMMARY OF THE INVENTION

Broadly speaking, the present invention fills these needs by providingan apparatus and related methods for optimizing the rinsing operation ofa spin, rinse, and dry (SRD) module. Preferably, the SRD module isconstructed from chemically compatible components and is designed tofacilitate uniform delivery of rinsing fluid onto a surface of asubstrate to be rinsed. The SRD module is configured to include adelivery ring having a plurality of ring inlets and a plurality ofopposing ring outlets wherein the number of ring inlets are equivalentto the number of ring outlets. Also included are a plurality of slotsdefined between each ring inlet and its respective opposing outlet. Inone embodiment, a plurality of supply tubes are configured to deliverrinsing fluid onto the surface of the substrate utilizing the pluralityof the ring inlets, the ring outlets, and the slots. It should beappreciated that the present invention can be implemented in numerousways, including as a process, an apparatus, a system, a device, or amethod. Several inventive embodiments of the present invention aredescribed below.

In one embodiment, a fluid delivery module for use in preparing asubstrate is disclosed. The fluid delivery module includes a processbowl designed to contain a substrate to be prepared. The process bowlhas a bottom wall and a sidewall. Also included in the fluid deliverymodule is a fluid delivery ring configured to be attached to thesidewall of the process bowl. The fluid delivery ring includes aplurality of inlet and outlet pairs. Each of the plurality of inlet andoutlet pairs is defined in the fluid ring and is designed to receive arespective supply tube. Each respective supply tube has an end thatterminates at each of the outlets of the fluid delivery ring and isconfigured to direct fluid onto a surface of the substrate.

In another embodiment, a method for making a fluid delivery ring isdisclosed. The method starts by generating a solid ring having a sidesurface, a top surface, and an under surface. Then, a plurality of slotsare formed into the under surface of the solid ring. Each of theplurality of slots extends into the solid ring and defines a sidewallproximate to the side surface and a topwall proximate to the topsurface. Thereafter, the method proceeds to generating inlet holes andoutlet holes at each of the plurality of slots. The inlet holes aredefined into an intersection of the sidewall and the under surface andthe outlet holes are defined into an intersection of the topwall and theunder surface. The respective inlet holes, outlet holes and slots definepaths for receiving tubes. The tubes are configured to deliver the fluidto a region within the fluid delivery ring.

In yet another embodiment, a method for rinsing a semiconductor wafer ina module utilizing a fluid delivery ring is disclosed. The method startsby providing a process bowl having a generally circular shape bottomwall and a sidewall. The sidewall extends upwardly from the bottom wallto define a cylindrical chamber. The sidewall further includes aplurality of channels extending from the bottom wall to an upper edge ofthe sidewall. Next, the method proceeds by attaching a fluid deliveryring onto the sidewall of the process bowl. Then, a plurality of supplytubes are inserted into the fluid delivery ring, utilizing the processbowl. The fluid delivery ring includes a plurality of ring inlet andoutlet pairs and a plurality of respective slots. Subsequently, fluid isdelivered to the supply tubes and is directed onto a surface of asemiconductor wafer defined within the process bowl.

In still a further embodiment, a fluid delivery ring attached to asidewall of a process bowl for use in a substrate spin module isdisclosed. The fluid delivery ring includes a plurality of inlet andoutlet pairs defined in the fluid delivery ring. Each of the pluralityof inlet and outlet pairs is designed to receive a respective supplytube. Each respective supply tube has an end that terminates at each ofthe outlets of the fluid delivery ring and is configured to direct fluidonto a surface of the substrate.

In still a further embodiment, a fluid delivery ring for use in asubstrate rinsing module is disclosed. The fluid delivery ring includesa triangular structure having a sidewall, an underside, and a generallycircular shape topwall. The fluid delivery ring also includes aplurality of inlet and outlet pairs. The inlets are defined between thesidewall and the underside and the outlets are defined between theunderside and the topwall. Each inlet and outlet pair is configured toreceive and secure a plurality of respective supply tubes. Each of therespective supply tubes is configured to terminate at each of therespective outlets and to deliver fluid on to a surface of a substrateto be prepared.

The advantages of the present invention are numerous. Most notably,instead of using a single fluid delivery spigot, a fluid delivery ringhaving multiple fluid delivery points for uniformly delivering fluidonto the substrate surface is utilized. The fluid delivery ring of thepresent invention supplies fluid through a plurality of supply tubes,which are fed through a plurality of inlets and outlets. In the presentinvention, the outlets are configured to be distanced from the edge ofthe substrate surfaced. Thus, the embodiments of the present inventioneliminate the post process contamination of an otherwise clean surfaceof a substrate with potential droplets of fluid remained in the spigot.Another advantage of the SRD module of the present invention is that theSRD module utilizes all chemically compatible components so as toprevent introduction of additional contaminants into the spin rinsingoperation. Still another advantage of the fluid delivery ring of thepresent invention is that it is retrofittable, thereby allowing the SRDmodule to spin rinse various sized wafers. Ultimately, the fluiddelivery ring is capable of delivering fluid to multiple criticalcontact points on the surface of the wafer thus optimizing the overallperformance of the SRD module.

Other aspects and advantages of the invention will become apparent fromthe following detailed description, taken in conjunction with theaccompanying drawings, illustrating by way of example the principles ofthe invention.

BRIEF DESCRIPTION OF THE DRAWINGS

The present invention will be readily understood by the followingdetailed description in conjunction with the accompanying drawings, andlike reference numerals designate like structural elements.

FIG. 1 illustrates an exemplary prior art spin, rinse, and dry (SRD)module.

FIG. 2A is a simplified cross-sectional view of an SRD module, whereinthe SRD process bowl is defined in a lower position, in accordance withone embodiment of the present invention.

FIG. 2B is a simplified cross-sectional view of the SRD module shown inFIG. 2A, wherein the SRD process bowl is in an upper position, inaccordance with another embodiment of the present invention.

FIG. 3A is an enlarged, simplified, cross-sectional view of a fluiddelivery ring having a plurality of slots, in accordance with yetanother embodiment of the present invention.

FIG. 3B is an enlarged, simplified, cross-sectional view of a fluiddelivery ring having a guiding channel, in accordance with one aspect ofthe present invention.

FIG. 3C is an enlarged, partial, cross-sectional view of an SRD moduleutilizing one contiguous supply tube, in accordance with another aspectof the present invention.

FIG. 4A is a three-dimensional view of a fluid delivery ring having aplurality of ring inlets, a plurality of corresponding ring outlets, anda plurality of corresponding slots, in accordance with another aspect ofthe present invention.

FIG. 4B is a top-view of a fluid delivery ring, in accordance with yetanother aspect of the present invention.

FIG. 4C is a simplified cross-sectional view of a fluid delivery ring,in accordance with another embodiment of the present invention.

FIG. 4D-1 is a partial three-dimensional view of a fluid delivery ring,illustrating one of several hollow cavities, slots of the fluid deliveryring, in accordance with yet another embodiment of the presentinvention.

FIG. 4D-2 is a three-dimensional view of the slot of FIG. 4D-1,depicting a removed volume of the fluid delivery ring, in accordancewith yet another aspect of the present invention.

DETAILED DESCRIPTION OF EXEMPLARY EMBODIMENTS

Embodiments of a spin, rinse, and dry (SRD) module and a fluid deliveryring for use in an SRD module for optimizing the rinsing operation of asubstrate surface while minimizing the possibility of surfacerecontamination are described. Preferably, the SRD module is configuredto include all chemically compatible components. In a preferredimplementation, the SRD module is configured to facilitate uniformdelivery of rinsing fluid onto the surface of the substrate beingrinsed. Preferably, the SRD module includes a fluid delivery ring havinga plurality of ring inlets and a plurality of opposing ring outlets,wherein the number of ring inlets are equivalent to the number ofopposing ring outlets. Rinsing fluid is configured to be uniformlysupplied to the fluid delivery ring through a plurality of supply tubesutilizing the plurality of the ring inlets and the ring outlets. In onepreferred embodiment, each of the supply tubes is configured to be acontiguous tube.

In the following description, numerous specific details are set forth inorder to provide a thorough understanding of the present invention. Itwill be understood, however, to one skilled in the art, that the presentinvention may be practiced without some or all of these specificdetails. In other instances, well known process operations have not beendescribed in detail in order not to unnecessarily obscure the presentinvention.

FIG. 2A is a simplified cross-sectional view of a spin, rinse, and dry(SRD) module 200, in accordance with one embodiment of the presentinvention. As shown, the SRD unit 200 includes an SRD process bowl 202,which in this embodiment, is defined in a lower position. The SRDprocess bowl 202 has a generally cylindrical shape and is defined withinan SRD process chamber 218 also having a cylindrical shape. The SRDprocess bowl 202 is defined on a shaft 217, and the shaft is configuredto rotate in a rotation direction 212. The SRD process bowl 202 isfurther configured to move upwardly from the lower position so as toassume an upper position. A spindle 206 is positioned within the SRDprocess bowl 202 and is configured to extend through the bowl 202 withone of its ends being rigidly mounted and the other end being coupled toa chuck 210. A plurality of spindle fingers 208 are mounted on the chuck210 and are configured to support wafer 104 during the SRD operation.

A sidewall 202 b of the SRD process bowl 202 has a lip 202 a definedsubstantially in a same horizontal plane as a ring 226, which is mountedon a ring support 211. The lip 202 a of the SRD bowl is configured to bea continuous ring that extends around the inner surface of the SRDprocess chamber 218. In one embodiment, defined along the circumferenceof the bowl bottom wall 202 b ″ of the SRD process bowl 202 and insidethe bowl sidewall 202 b of the SRD process bowl 202 are a plurality ofchannels 202 b′. Each of the channels 202 b′ is defined to extendupwardly from each of the plurality of the bottom wall holes 202 cformed in the bowl bottom wall 202 b″ of the SRD process bowl 202substantially up to the lip 202 a of the SRD process bowl 202. It mustbe appreciated by one of ordinary skill in the art that the number ofchannels 202 b′ may vary depending upon a particular application. In oneexemplary embodiment, the number of the channels 202 b′ is configured torange from about 1 channels to about 12 channels. In a preferredembodiment, the number of channels 202 b′ is approximately about 8channels.

A fluid delivery ring 220 is configured to engage the lip 202 a of theSRD process bowl 202. The fluid delivery ring 220 is configured todeliver fluid onto the surface of the wafer 104 during the spin rinsingoperation. The fluid can be either a liquid (e.g., DI water, chemicals,etc.) or a gas. Fluid is configured to be supplied to the fluid deliveryring through a plurality of continuous supply tubes 222. The supplytubes 222 are first fed through the plurality of bottom wall holes 202c. Thereafter, the supply tubes 222 are fed to the channels 202 b′ andthe lips 202 a of the SRD process bowl to a plurality of ring inlets 220e and ring outlets 220 e′ of the fluid delivery ring 220.

Each of the supply tubes 222 is configured to be fitted with a pluralityof seals 224. The seals 224 are disposed in close proximity to thebottom wall holes 202 c. As such, a seal is defined substantially closeto an opening of each of the channels 202 b′. The use of the pluralityof seals 224 are advantages as they hold each of the supply tubes 222secure in its defined position in the bottom wall of the SRD processbowl 202. The seals 224 are further configured to prevent theintroduction of contaminants into the SRD process bowl 202 and the fluiddelivery ring 220. It should be appreciated by one of ordinary skill inthe art that although the embodiment of this Figure implements onesupply tube 222, in a different embodiment, the present invention can beimplemented such that a plurality of supply tubes 222 can be fed througheach of the channels 202 b′. In such situations, the size of the supplytubes 222 can vary such that the plurality of supply tubes 222 are fedto each of the channels 202 b′. Alternatively, the size of each channel202 b′ may be changed such that one or more supply tubes 222 are fedinto each channel 202 b′. Of course, depending on the application, themodule is designed such that some channels 202 b′ are fed with a singlesupply tubes 222 while others are fed with multiple smaller supply tubes222. In addition, in the situations wherein a plurality of supply tubes222 are fed into each channel 202 b″, the module is designed such that,if necessary, each supply tube 222 may deliver a different type of fluidonto the surface of the wafer being prepared. Additional detailsregarding the shape of the fluid delivery ring 220, the ring inlets 220e and the ring outlets 220 e″, and the supply tubes are set forth belowin connection with the descriptions of FIGS. 3A-4D-2.

The SRD process chamber 218 is defined above the SRD process bowl 202.The SRD process chamber 218 is configured to be slightly larger than theSRD process bowl 202 so that the SRD process chamber 218 can enclosearound the SRD process bowl 202 when the SRD process bowl 202 is in theupper position. A stop 228 having a seal 228′ is defined on the innersurface of the SRD process chamber 218. In this embodiment, each of thestop 228 and the seal 228′ is extending continuous ring. However, itmust be appreciated by one of ordinary skill in the art that the stop228 and the seal 228′ may be defined by any number of continuous ringsor that the stop 228 and the seal 228′ may be of any shape.

As illustrated, once the SRD process bowl 202 is in the lower position,the wafer 104 is passed through a portal 218a of the SRD process chamber218. In one embodiment, the wafer 104 is passed through a portal 218 awith a robotic arm on a wafer transfer path. Once the wafer 104 has gonethrough the spin rinsing operation, the wafer 104 is then removed fromthe process chamber 218 with a robotic arm. Although in this embodimenta robotic arm has been utilized to deliver and remove wafer 104 from theprocess chamber 218, it must be appreciated by one of ordinary skill inthe art that other equivalent mechanism may be utilized so long as thefunction of delivering and removing the wafer from the process chamberis achieved (e.g., such as a wafer transfer path).

FIG. 2B is a simplified partial cross-sectional view of the SRD moduleof 200 shown in FIG. 2A with the SRD process bowl 202 being in the upperposition. In this embodiment, as illustrated, an air cylinder 219 isconfigured to raise a bracket 205 and consequently the SRD process bowl202 mounted on a bracket 205 to the upper position. Although the aircylinder 219 has been utilized to raise the bracket 205, it should beapparent to those skilled in the art that other equivalent drivemechanisms may also be used so long as the function of moving thebracket 205 up and down to and from the upper position is achieved(e.g., electric cylinder, servo motor, screw drives, belt drives, etc.).

Furthermore, in this embodiment, the chuck 210 (not shown in thisdrawing) of the embodiment of FIG. 2B is configured to remain in place.Therefore, unlike the conventional SRD modules that use the movement ofthe chuck to move the wafer to the upper or lower position, theembodiments of the present invention utilize an air cylinder 219 to movethe SRD process bowl 202. Consequently, the present invention hasseveral advantages over the prior art. First, as the chuck 210 remainsin place, unlike the prior art SRD module, the present inventioneliminates the problems associated with the necessity of designing acomplex chuck. Second, since the chuck 210 does not move up or downwithin the SRD process bowl 202, the chuck 210 would not introducecontaminants and particulates in to the SRD process bowl 202. In oneimplementation, the chuck 210 of the present invention may be a hollowcore chuck having a wafer backing plate as described in U.S. patentapplication Ser. No. 09/470,690, filed on Dec. 23, 1999, having inventorRoy Winston Pascal, and entitled “Hollow Core Spindle and Spin, Rinse,and Dry Module Including the Same.” Furthermore, in a differentembodiment, the bowl 202 may be a bowl described in the U.S. patentapplication Ser. No. 09/470,676, filed on Dec. 23, 1999, havinginventors Roy Winston Pascal and Brian M. Bliven, and entitled “Bowl,Spin, Rinse, and Dry Module, and Method for Loading a SemiconductorWafer into a Spin, Rinse, and Dry Module.” These U.S. PatentApplications, which are assigned to Lam Research Corporation, theassignee of the subject application, are incorporated herein byreference.

As illustrated in FIG. 2B, the SRD process bowl 202 is raised until anupper edge of the SRD bowl 202 is engaged by the stop 228 of the SRDprocess chamber 218. As shown, when the SRD process bowl 202 is in theupper position, the wafer 104 is disposed slightly above the ring 226.This is advantages because as the fluid delivery ring 220 is engaged onthe lip 202 a of the SRD process bowl 202, the ring outlet 220 e′ of thefluid delivery ring 220 is configured to be sufficiently distanced fromthe wafer 104. As such, any fluid droplets coming from supply tubes 222at ring outlets 220 e′ do not recontaminate the surface of the SRDprocessed wafer 104. That is, any droplets would simply fall into thebowl 202 without touching the rinsed surfaces of the wafer 104.

FIG. 3A is an enlarged, simplified, cross-sectional view of a fluiddelivery ring 220, in accordance with one aspect of the presentinvention. As shown, in this embodiment, the cross-section of the fluiddelivery ring 220 is configured to be in a shape of a triangle and isdefined by a ring sidewall 220 a, ring topwall 220 b, and a ring hollowportion underside 220 c. The ring hollow portion underside 220 c isadjacent to an exit surface 220 h. In one embodiment, the ring topwall220 b, which defines the top surface of the fluid delivery ring 220 isconfigured to be a downwardly sloped surface. The ring underside hollowportion 220 c represents a partial cavity, defined as a slot 220 f,formed within the fluid delivery ring 220. An opening defined as a ringinlet 220 e is defined at the intersection of the hollow portionunderside 220 c and the ring sidewall 220 a. In a like manner, a holedefined as a ring outlet 220 e′ is defined between the exit surface 220h and the ring topwall 220 b. A supply tube 222, not shown in thisFigure, is to be fed into the fluid delivery ring 220 through the ringinlet 220 e.

As shown, in the configuration of FIG. 3A, the fluid delivery ring 220is configured to be a solid core structure having a plurality of slots220 f. However, in a different configuration, as shown in the embodimentof FIG. 3B, the fluid delivery ring may be in the form of a solidstructure. The fluid delivery ring 220′ of FIG. 3B is defined by ringstructures 220 a ₁. A guiding channel 220 f′ is configured to bedisposed within the ring structures 220 a ₁. In this embodiment, asupply tube 222 is to be fed into the guiding channel 220 f′ of thefluid delivery ring 220 through the ring inlet 220 e. Preferably, theinner diameter of each of the ring inlets 220 e and ring outlets 220 e′approximately ranges from about ⅛ inch to about {fraction (5/32)} inch,with a preferable diameter of about ⅛ inch.

Although in the implementations of FIGS. 3A and 3B the cross-sections ofthe fluid delivery ring 220 are in the form of triangles, it must beappreciated by one skilled in the art that the cross-section of thefluid delivery ring 220 may be in any shape. Furthermore, although onlyone supply tube 222 is shown in FIG. 3B, it must be appreciated by oneof ordinary skill in the art that depending on the size of the waferimplemented or the process, any number of supply tubes may be fedthrough each channel 202 b′ so as to optimize the operation of the SRDmodule. As will be shown below, for an exemplary 300 mm wafer, 8 supplytubes 222 are defined equally around the fluid delivery ring 220. Ofcourse, not all supply tubes 222 need to be used at the same time, anddifferent types of fluids can be provided to the various supply tubes222 depending on the application.

FIG. 3C is an enlarged, partial, cross-sectional view of an SRD module200 illustrating the use of a continuous supply tube 222, in accordancewith one implementation of the present invention. In this embodiment,initially, the supply tube 222 is fed to a channel 202 b′ of a sidewall202 b of an SRD process bowl 202 through a bottom wall hole 202 c of theSRD process bowl 202. Thereafter, the supply tube 222 is deliveredthrough the channel 202 b′ and a lip 202 a of the SRD process bowl 202to a ring inlet 220 e of a fluid delivery ring 220. Subsequently, thesupply tube 222 exits the fluid delivery ring 220 through a ring outlet220 e′. As shown, in one embodiment, the supply tube 222 is preferably asingle continuous tube so as to improve the integrity of the fluidsupply path thus preventing the introduction of contaminants throughoutthe path. However, in a different embodiment, multiple tube segments maybe interconnected so as to define the supply tube 222.

As shown in the embodiment of FIG. 3C, a seal 224 is disposed in thebottom wall 202 b″ of the SRD process bowl 202 along the channel 202 b′so as to secure the supply tube in its place and to prevent fluidleakage. In addition to the seal 224, an optional seal 224′ may bedefined within the sidewall 202 b of the SRD process bowl 202 andsubstantially close to the lip 202 a of the SRD process bowl 202, towardthe upper end of the channel 202 b′. The optional seal 224′ may beutilized to further secure the supply tube within the channel 202 b′ andto further prevent introduction of contaminants into the spin rinsingoperation.

Preferably, in the SRD modules utilizing a single supply tube 222, theinner diameter of the supply tube 222 ranges approximately from about0.060 inch to about 0.188 inch, and is preferably about 0.060 inch. Assuch, for an about ⅛ inch supply tube, the flow rate of the fluid can beapproximately about 0.7 at about 35 p.s.i.

The SRD module 200 of the FIG. 3C is configured to deliver fluid to thesurface of the wafer 104 without recontaminating the surface of thewafer 104. In the conventional SRD modules, the fluid is delivered ontothe surface of the wafer 104 via a spigot disposed above the surface ofthe wafer 104. As such, the droplets of the remaining fluidrecontaminate the surface of the processed wafer. In contrast,preferably, in this embodiment of the present invention, the fluiddelivery ring 220 is engaged on the lip 202 a of the SRD process bowl202 such that the ring outlet 220 c′ of the fluid delivery ring 220 issufficiently distanced from the wafer 104. The distancing of the wafer104 is achieved as a result of positioning the surface of the wafer 104on a horizontal plane, which is positioned substantially below thehorizontal plain of the ring outlet 220 e′ of the fluid delivery ring220. In addition, the vertical plane within which the ring outlet 220 e′is positioned, is configured to be substantially closer to the sidewall202 b of the SRD process bowl 202 than that of the edge of the wafer104. Accordingly, the fluid droplets remained in the supply tube 222cannot recontaminate the an otherwise clean, rinsed, or prepared surfaceof the wafer 104.

In addition, preferably, the supply tube 222, the fluid delivery ring220, and the SRD process bowl 202 are manufactured from a chemicallyinert material (e.g., Teflon™. This is advantageous as it eliminates theissues associated with the use of chemically incompatible components ofthe prior art conventional SRD modules. However, it must be appreciatedby one of ordinary skill in the art that the supply tube 222, the fluiddelivery ring 220, the SRD process bowl 202, and all the othercomponents of the SRD module may be manufactured from differentmaterials so long as the utilized materials are chemically compatible soas to reduce the introduction of contamination into the SRD module(e.g., flouroloy, polypropylene, polyvinylidene fluoride (PVDF),polyethylene, etc.).

FIG. 4A is a three-dimensional view of a fluid delivery ring 220 havinga plurality of ring inlets 220 e and the corresponding ring outlets 220e′ and slots 220 f. In the embodiment of FIG. 4A, the ring inlets 220 eand the corresponding opposing ring outlets 220 e′ are configured to bedefined around the fluid delivery ring 220 such that the ring inlets 220e are substantially symmetrical. In one embodiment, the number of thering inlets 220 e and ring outlets 220 e′ are about eight. However, thepairs of ring inlets 220 e and ring outlets 220 e′ may vary to anynumber and be arranged using any relative spacing to achieve the desiredfluid application profile over a substrate.

A plurality of hollow cavities defined as slots 220 f are defined withinthe fluid delivery ring 220 substantially between each of the ringinlets 220 e and its corresponding ring outlet 220 e′. In one preferredembodiment, the number of slots 220 f are configured to be equivalent tothe pairs of ring inlets 220 e and ring outlets 220 e′. The slots 220 fare designed so that a supply ring 222 can exit from the fluid deliveryring 220 after the supply tube is inserted into the fluid delivery ring220 through one of the ring inlets 202 e. Thus, in one implementation,fluid (e.g., DI water) is to be substantially uniformly distributed overthe surface of the wafer 104 through the supply tubes 222. As such,preferably, the supply tubes 222 are fed through the ring inlets 220 eand out of the opposing ring outlets 220 e′ to deliver the fluid ontothe surface of the wafer 104.

Further illustrated in FIG. 4A is a general direction of each of thesupply tubes 222. As shown, each of the supply tubes 222 is generallydirected toward a center region 241 of the wafer 104 in the centerregion direction 240. As such, in one embodiment, DI water is directedtoward the center region 241 of the wafer 104. However, in a differentembodiment, other fluids such as chemicals (e.g., HF) used in etchinglayers of films formed over wafers, and gases (e.g., N₂) may bedelivered to the SRD module utilizing one or more of the remaining pairsof ring inlets 220 e and outlets 220 e′.

FIG. 4B is a top-view of the fluid delivery ring 220 and depicts thepositions of the ring inlets 220 e, and their corresponding ring outlets220 e′ and slots 220 f, in accordance with one embodiment of the presentinvention. As illustrated, for a 300 mm wafer, in one embodiment, theinner radius D₂₂₀ of the fluid delivery ring may range fromapproximately about 13.5 inches to about 4 inches, and preferably isabout 13.125 inches. Furthermore, the angle θ, which corresponds to thecircular distance between the two adjacent ring outlets 220 e′ as wellas the two adjacent ring inlets 220 e, approximately ranges from about30 degrees to about 180 degrees, and preferably is about 45 degrees.

An A—A cross-sectional view of the fluid delivery ring 220 of FIG. 4B isdepicted in FIG. 4C, in accordance with another embodiment of thepresent invention. Illustrated in the embodiment of FIG. 4C are aplurality of ring inlets 220 e as well as their corresponding ringoutlets 220 e′ and slots 220 f. Also shown are the downwardly slopedring topwall 220 b of the fluid delivery ring 220.

As shown, preferably, a width of each slot 220 f approximately rangesfrom about 0.125 inch to about 0.250 inch, and preferably is about ⅛inch. In addition, the thickness T₂₂₀ of the fluid delivery ring 220ranges approximately from about 0.75 inches to about 2.00 inches, andpreferably is approximately about 1.722 inches.

FIG. 4D-1 is a partial three-dimensional view of a fluid delivery ring220, illustrating one of several hollow cavities, slots 220 f of thefluid delivery ring 220, in accordance with another embodiment of thepresent invention. As illustrated, a removed volume 220 f ₁ is definedwithin the fluid delivery ring so as to allow the supply tube 222 (notshown in this drawing) be inserted into the fluid delivery ring 220through a ring inlet 220 e and exit through a ring outlet 220 e′. Asshown, in one embodiment, the removed volume 220 f ₁ may have a profilesubstantially similar to that of the fluid delivery ring 220. However,it must be appreciated to one of ordinary skill in the art that theprofile of the removed volume 220 f ₁ may have a different shape.

FIG. 4D-2 is a three-dimensional view of the removed volume 220 f ₁ ofthe slot of FIG. 4D-1, in accordance with another aspect of the presentinvention. As shown, the removed volume 220 f ₁ has a solid core and ismade out of Teflon™. In a preferred embodiment, the thickness T_(volume)of the removed volume approximately ranges from about 0.125 inch toabout 0.250 inch, and is preferably about ⅛ inch.

Although the foregoing invention has been described in some detail forpurposes of clarity of understanding, it will be apparent that certainchanges and modifications may be practiced within the scope of theappended claims. For example, embodiments described herein have beenprimarily directed toward spinning, rinsing, and drying (SRD) wafers;however, it should be understood that the SRD module of the presentinvention is well suited for spin rinsing of any type of substrate.Furthermore, implementations described herein have been particularlydirected toward SRD module utilizing a 300-mm wafer; however, it shouldbe understood that the SRD module of the present invention is wellsuited for spin rinsing of any size wafer or substrate, such as harddisks. Accordingly, the present embodiments are to be considered asillustrative and not restrictive, and the invention is not to be limitedto the details given herein, but may be modified within the scope andequivalents of the appended claims.

What is claimed is:
 1. A fluid delivery module for use in preparing asubstrate, the fluid delivery module comprising: a process bowl designedto contain a substrate to be prepared, the process bowl having a bottomwall and a sidewall; a fluid delivery ring configured to be attached tothe sidewall of the process bowl, the fluid delivery ring including, aplurality of inlet and outlet pairs being defined in the fluid deliveryring, each of the plurality of inlet and outlet pairs being designed toreceive a respective supply tube, each respective supply tube having anend that terminates at each of the outlets of the fluid delivery ringand configured to direct fluid onto a surface of the substrate.
 2. Afluid delivery module for use in preparing a substrate as recited inclaim 1, wherein the sidewall of the bowl further comprise: a pluralityof channels equal to a number of supply tubes, such that the supplytubes feed through the each of the plurality of channels that lead tothe plurality of inlet and outlet pairs in the fluid delivery ring.
 3. Afluid delivery module for use in preparing a substrate as recited inclaim 2, further comprising: a respective seal being configured tosecure the supply tubes within the respective channels of the processbowl sidewall.
 4. A fluid delivery module for use in preparing asubstrate as recited in claim 1, wherein each end of the respectivesupply tubes is generally directed toward a center region defined by thefluid delivery ring, the center region defining a location of thesubstrate.
 5. A fluid delivery module for use in preparing a substrateas recited in claim 4, wherein the fluid delivery ring furthercomprises: a plurality of slots defined at a location of each of theinlet and outlet pairs, each slot being configured to define a path forthe respective supply tubes.
 6. A fluid delivery module for use inpreparing a substrate as recited in claim 4, wherein the fluid deliveryring, the process bowl, and the respective supply tubes are each definedfrom a chemically inert material.
 7. A fluid delivery module for use inpreparing a substrate as recited in claim 4, wherein the fluid deliveryring has a triangular cross-sectional shape.
 8. A fluid delivery modulefor use in preparing a substrate as recited in claim 7, wherein theinlet and outlet pairs are defined at opposing corners of the triangularcross-sectional shape, and the outlets of the inlet and outlet pairs aredefined around one of the corners that is most proximate to the centerregion.
 9. A fluid delivery module for use in preparing a substrate asrecited in claim 8, wherein the outlets of the fluid delivery ring aredefined around a ring diameter of the fluid delivery ring that is largerthan a diameter of the substrate .
 10. A fluid delivery module for usein preparing a substrate as recited in claim 1, wherein the process bowlis configured to enclose a chuck for holding and rotating the substrate.11. A fluid delivery module for use in preparing a substrate as recitedin claim 10, wherein the chuck is configured to be fixed at a height andthe process bowl is configured to move between a first position and asecond position.
 12. A fluid delivery module for use in preparing asubstrate as recited in claim 1, wherein the fluid is selected from oneor more of DI water, chemicals, and gases, each being configured to besupplied to a surface of the substrate to enable the preparation.
 13. Afluid delivery module for use in preparing a substrate as recited inclaim 1, wherein the substrate is a semiconductor wafer.
 14. A fluiddelivery ring for use in a substrate spin module, the fluid deliveryring configured to be attached to a sidewall of a process bowl, thefluid delivery ring comprising: a plurality of inlet and outlet pairsbeing defined in the fluid delivery ring, each of the plurality of inletand outlet pairs being designed to receive a respective supply tube,each respective supply tube having an end that terminates at each of theoutlets of the fluid delivery ring and configured to direct fluid onto asurface of the substrate.
 15. The fluid delivery ring as claimed inclaim 14, wherein each of the respective supply tubes is configured todeliver fluid onto a surface of the substrate in a general direction ofa center region, the center region being a location of the substrate tobe prepared.
 16. The fluid delivery ring as claimed in claim 14, whereinthe fluid delivery ring, the process bowl, and the respective supplytubes are each defined from a chemically inert material.
 17. The fluiddelivery ring as claimed in claim 14, wherein the outlets of the fluiddelivery ring are defined around a ring diameter of the fluid deliveryring that is larger than a diameter of the substrate to be prepared. 18.A fluid delivery ring for use in a substrate rinsing module, the fluiddelivery ring comprising: a triangular structure having a sidewall, anunderside, and a generally circular shape topwall; a plurality of inletand outlet pairs, the inlets being defined between the sidewall and theunderside and the outlets being defined between the underside and thetopwall, each inlet and outlet pair being configured to receive andsecure a plurality of respective supply tubes, wherein each of therespective supply tubes is configured to terminate at each of therespective outlets and to deliver fluid on to a surface of a substrateto be prepared.
 19. The fluid delivery ring as claimed in claim 18,wherein the fluid delivery ring is constructed from a chemically inertmaterial.
 20. A fluid delivery ring as claimed in claim 18, wherein theinlet and outlet pairs are respectively defined between the sidewall andthe underside and the topwall and the underside, symmetrically.
 21. Afluid delivery ring as claimed in claim 18, further comprising: aplurality of slots defined within the triangular structure, each of therespective slots being defined between each of the inlet and outletpairs and on the underside of the triangular structure.